Murata will join industry leaders at the Open Compute Project (OCP) Global Summit, highlighting how its innovations are powering the future of artificial intelligence (AI) and accelerating the open compute ecosystem. The event takes place October 12-15 in San Jose at the McEnery Convention Center at Booth A15.
Through a series of demonstrations, Murata will showcase advanced Open Rack V3 (ORV3) and High-Power Rack (HPR) power delivery platforms, and next-generation thermal management solutions. Guests will gain firsthand insight into how Murata is helping data center operators improve efficiency, enhance reliability, and scale infrastructure to meet the demands of AI and high-performance computing workloads.
Additionally, as part of the summit’s speaker series, Kevin Gero, Senior Manager, Product Marketing, and Miguel Millan Montanes, Application Marketing Engineer, both of Murata, will present “Powering Progress: Murata’s Role in Advancing OCP Innovation” on Thursday, October 15, at 10:20 a.m.PT. The session will explore Murata’s latest advancements in power delivery, including key developments supporting ORV3 and HPR initiatives, as well as the critical components and enabling technologies driving next generation data center architectures. Gero will share insights into the industry's evolution from 50V power delivery architectures in ORV3 toward emerging 800V solutions and discuss how Murata is engineering technologies that align with OCP’s ambitious goals for efficiency, power density, and performance.
For more information about Murata’s participation in the 2026 OCP Global Summit, please visit here.
Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world.